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Kanishka Wijewardena

Michigan State University

Email:

wijewar2 (at) msu (dot) edu

I am a third-year Ph.D. student at Michigan State University

EDUCATION

EDUCATION

Expected May 2026

Michigan State University

East Lansing, Michigan

Doctor of Philosophy (Ph.D.)

in Computer Science

2021 - 2024

Michigan State University

East Lansing, Michigan

Master of Science (M.S.)

in Computer Science

  • GPA: 3.75

2017 - 2021

Bachelor of Science (B.S.)

in Computer Engineering

Michigan State University

East Lansing, Michigan

  • GPA: 3.92

  • Minor in Mathematics; Honors College; Dean’s List

RESEARCH AND TEACHING EXPERIENCE

RESEARCH EXPERIENCE

JAN 2023 -  PRESENT

Department of Computer Science and Engineering, Michigan State University

Graduate Assistant

  • Advised by Prof. Li Xiao of the exploratory Laboratory for Advanced Network Systems (eLANS) in the Department of Computer Science at Michigan State University.

  • Investigating applications of Deep Learning in Next Generation Wireless Communications (6G and Beyond) and Internet of Things (IoT), including Semantic Communication and Non Orthogonal Multiple Access.

Teaching Assistant

  • Teaching Assistant for CSE 102: Algorithmic Thinking and Programming, during the Spring and Summer semesters of 2023. Assisted class instructors in the preparation of assignments and examinations, and with other administrative tasks as required. Supervised Undergraduate Learning Assistants (ULAs) during student help room sessions, and assisted students with class assignment-related concerns during help room hours.

MAY 2021 - DEC. 2022

Department of Computer Science and Engineering, Michigan State University

Graduate Research Assistant

  • Conducting fingerprint verification, template inversion, spoof detection and data analysis using computer vision and deep learning tools.

  • Conducting face biometric template verification and identification using open-source and commercial-off-the-shelf face matchers and analyzing the differences between the matching accuracies of different face matching software and algorithms.

Sep. 2017 – Aug. 2020

Department of Electrical and Computer Engineering, Michigan State University

Undergraduate Research Assistant

Engineering Summer Undergraduate Research Experience (EnSURE): Summers 2019 and 2020

  • Assisted with the design of Printed Circuit Board layouts for circuits, based on outlines provided.

  • Implemented a sample simulation program in Python to demonstrate a Block Chain inspired RFID based information architecture for a food supply chain.

  • Designed a prototype smartphone-based application for remote IoT sensors monitoring

LEADERSHIP EXPERIENCE

2021- Present

Department of Computer Science and Engineering

Michigan State University

LEADERSHIP AND OUTREACH EXPERIENCE

2021-2022

Ohio Innocence Project,

University of Cincinnati College of Law

Volunteer

  • Providing neutral and unbiased technical expertise by conducting face identification, verification and data analysis on photographic and video evidence using open-source and commercial-off-the-shelf face matchers, without being privy to the details of an ongoing case, or prior conviction.

2018 - 2021

​Michigan State University

Residence Education

  • As a Resident Assistant (Aug. 2019 – May 2020, Aug. 2020 – May 2021) in Holmes Hall, MSU, organized community events, provided resources to residents, and promoted diversity, equity, and inclusion initiatives. In addition, conducted duty rounds, handled mandatory reporting responsibilities, enforced policy, and maintained overall wellbeing of students during the academic year, and the COVID-19 pandemic.

  • As an Intercultural Aide (Aug. 2018 – May 2019) in Holmes Hall, MSU, collaborated with Resident Assistants (RAs) to conduct outreach, organize events, and maintain the wellbeing of the residential community. Organized and facilitated weekly roundtable discussions that discuss socially, culturally, and politically relevant topics within the MSU community.

 Sep. 2017 – May 2021

International Scholars Advisory Board,

​Michigan State University

President (May 2020 - May 2021)

Member (September 2017 - May 2020)

  • ​Organizing monthly meetings and events intended to foster the academic, social, and personal growth of international students in the Honors College.

May 2018 - May 2019

Member

Tower Guard, Class of 2018 - 2019

  • Collaborated with the MSU Resource Center for Persons with Disabilities (RCPD) to assist students with disabilities gain equal access to educational and other opportunities by organizing events, assisting with examinations, acting as a class scribe and performing other miscellaneous duties, as requested by the RCPD.

PUBLICATIONS

PUBLICATIONS
  • Lagwankar, Ishaan and Kanishka P. Wijewardena. “Causality Diagrams using Hybrid Vector Clocks.” ArXiv abs/2311.07535 (2023)
  • X. Zhang, G. Klevering, K. Wijewardena and L. Xiao, "Demo: Integrated On-site Localization and Optical Camera Communication for Drones," 2023 IEEE 24th International Symposium on a World of Wireless, Mobile and Multimedia Networks (WoWMoM), Boston, MA, USA, 2023, pp. 334-336, doi: 10.1109/WoWMoM57956.2023.00055.
  • S. A. Grosz, K. P. Wijewardena and A. K. Jain, "ViT Unified: Joint Fingerprint Recognition and Presentation Attack Detection," 2023 IEEE International Joint Conference on Biometrics (IJCB), Ljubljana, Slovenia, 2023.
  • K. P. Wijewardena, S. A. Grosz, K. Cao and A. K. Jain, "Fingerprint Template Invertibility: Minutiae vs. Deep Templates," in IEEE Transactions on Information Forensics and Security, vol. 18, pp. 744-757, 2023, doi: 10.1109/TIFS.2022.3229587.
  • S. Mondal, K. P. Wijewardena, S. Karuppuswami, N. Kriti, D. Kumar, and P. Chahal, “Blockchain Inspired RFID-Based Information Architecture for Food Supply Chain,” IEEE Internet of Things Journal, vol. 6, no. 3, pp. 5803–5813, 2019.

  • S. Mondal et al., "A Wireless Battery-less Seat Sensor for Autonomous Vehicles," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 2289-2294, doi: 10.1109/ECTC32862.2020.00357.

  • S. Mondal, M. I. Mohd. Ghazali, K. Wijewardena, D. Kumar and P. Chahal, "3D Printed Interposer Layer for High Density Packaging of IoT Devices," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019, pp. 1687-1692.

SKILLS

SKILLS

TECHNICAL

Python - OpenCV, Numpy, TensorFlow, PyTorch

C/C++ - Arduino and other microcontroller programming, Object-Oriented Programming

MATLAB - Data analysis and visualization

OTHER

Public Speaking

Crisis Response and Mandatory Reporting

Event Organization

HTML+CSS, LaTeX, DaVinci Resolve

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